1、Journal of Applied Polymer Science

Developing effective latent curing agent for rapid curing of epoxy resins at low temperatures remains challenging. This study reports a latent curing agent, ortho-cresol phenolic epoxy resin-bisphenol A (EOCN-BPA), prepared through the addition reaction of o-methyl phenolic epoxy resin with BPA.

2、Conjugated imine phenolic resins with high strength, superior toughness

This study breaks these shackles by crosslinking biomass-based linear phenolic resins with conjugated imine bonds, producing a novel conjugated imine phenolic resin that achieves 100 % phenol and over 50 % formaldehyde substitution.

3、Curing mechanism of resole phenolic resin based on variable temperature

In this paper, to design composite curing process reasonably, the curing mechanism evolution of phenolic resin catalyzed by Ba (OH) 2 was investigated by variable temperature FT-IR and Thermogravimetry Mass Spectrometry (TG-MS).

4、Strategic moderation of thermal stability and curing time of lignin

In order to solve the problem of poor thermal stability of lignin-based phenolic resin (LPF), nanoparticles such as nano-SiO 2, nano-Al 2 O 3 and nano-TiO 2 were used as modifiers to modify LPF.

Curing reaction kinetics of paper

In summary, the study demonstrates a multimodal analysis of the resin curing process to enable detailed insights into the physicochemical drying and curing process of resol PF resin.

Curing mechanism of resole phenolic resin based on variable temperature

This work provides a new method to investigate the curing mechanism. It is a benefit for the rational design of the curing process of phenolic resin-based composites.

Research progress on modification of phenolic resin

In recent years, more and more researchers have focused on the discussion of the properties of modified phenolic resins and gradually ignored the research on the synthesis processes that can affect the molecular structure and properties of phenolic resins.

Dynamic light scattering study of the curing mechanisms of novolac

The curing behavior of a novolac resin (NV) cured with hexamethylenetetramine (HMTA), as well as the influence of an excess amount of HMTA on the curing reaction, were investigated by...

Fast Curing Bio

The chemical properties of lignin-based phenolic resins were studied by 13C-NMR and FT-IR spectroscopy, and their physical properties were also investigated. The results indicated that lignin-based phenolic resins exhibited faster curing rate and shorter gel time.

CURING MECHANISM OF PHENOLIC RESIN MODIFIED BY PHENYLPHENOL BASED ON

Abstract: To solve the problem that the curing mechanism of phenylphenol modified phenolic resin remained unclear, the characteristic structure hydroxymethyl, different substituent methylene, and ether bond were investigated by variable temperature FT-IR.

Modified Phenolic Resins: An Overview Modified phenolic resins are high-performance polymers derived from phenolic resins through chemical or physical modifications to their molecular structures. Among various modification techniques, low-temperature curing has garnered significant attention due to its energy-saving, eco-friendly, high-efficiency, and superior product performance characteristics. This paper explores the low-temperature curing technology of modified phenolic resins.

I. Introduction to Modified Phenolic Resins Modified phenolic resins are base phenolic resins enhanced with additives such as epoxy resins, silane coupling agents, nano-fillers, and other modifiers. These additions alter the molecular structure and properties of the resin, improving its heat resistance, mechanical strength, corrosion resistance, and dimensional stability for specialized applications.

II. Principles of Low-Temperature Curing Low-temperature curing refers to the cross-linking reaction of modified phenolic resins at ambient or slightly elevated temperatures, enabling solidification into a material. Compared to traditional high-temperature curing, this method offers advantages in energy conservation, environmental protection, and operational safety.

III. Advantages of Low-Temperature Curing for Modified Phenolic Resins

1. Energy and Environmental Efficiency: Eliminates the need for high-temperature heating, reducing energy consumption and emissions, aligning with green manufacturing principles.
2. High Production Efficiency: Faster reaction rates at lower temperatures accelerate curing time, enhancing productivity.
3. Superior Product Performance: Cured resins exhibit improved heat resistance, mechanical strength, and corrosion resistance, meeting demanding application requirements.
4. Enhanced Safety: Lower reaction temperatures minimize risks associated with high-temperature processing.

IV. Applications of Low-Temperature Cured Modified Phenolic Resins

1. Electronics and Electrical Engineering: Used as protective materials for circuit boards due to excellent electrical insulation and mechanical strength.
2. Aerospace: Applicable in structural components of aircraft and spacecraft, leveraging their high-temperature resistance.
3. Automotive Manufacturing: Employed in engine cooling systems, braking systems, and other critical parts.
4. Construction: Utilized in flooring, wall materials, and other building components.

V. Technical Challenges in Low-Temperature Curing

1. Reaction Condition Control: Precise temperature and timing control are critical for successful low-temperature curing.
2. Material Uniformity: Ensuring homogeneity during curing is challenging due to reduced material fluidity at low temperatures.
3. Post-Processing Requirements: Simplifying post-curing treatments to achieve optimal performance remains an area of focus.

VI. Conclusion and Outlook While low-temperature curing of modified phenolic resins offers substantial benefits, technical challenges persist. Ongoing advancements and research hold promise for overcoming these hurdles. Future innovations are anticipated to deliver even more efficient, eco-friendly, and safe curing technologies, providing robust support for industrial applications across diverse fields.