1、The curing characteristics and properties of bisphenol A epoxy resin
In this paper, the maleopimaric acid (MPAc) curing agent was prepared from a renewable resource, rosin, and blended with a petroleum-based curing agent (methylhexahydrophthalic anhydride) to cure bisphenol A epoxy resin.
2、Curing Kinetics of Bisphenol A
The curing reaction between epoxy resin and a curing agent is a highly complex process. Therefore, this paper aims to investigate the curing kinetics of the bisphenol A epoxy resin and aromatic amine system by employing the non-isothermal DSC method.
3、Experimental study on curing of bisphenol A epoxy resin
Taking the bisphenol A epoxy resin system as the research object, the thermal curing and microwave curing experiments were carried out. The relationship between the curing degree and the hardness of the product after thermal curing and microwave curing was analyzed.
4、Curing Kinetics of Bisphenol A
Two types of bisphenol A epoxy resins, E44 and E51, were cured using 4,4’- diaminodiphenylmethane (DDM) and 4,4’-diaminodiphenyl sulfone (DDS), respectively. The curing kinetics were...
5、Research on Curing Mechanism of Bisphenol
Abstract: Curing reaction of bisphenol-A epoxy resin were researched by non-isothermal DSC.
Curing reactions of epoxy powder coatings in perspectives of chemical
The properties of the cured products of epoxy powder coatings are dominated by the curing systems. This review discusses the types, reaction principles, characteristics of curing agents and accelerators that participate in the curing reaction with different epoxy resins.
Renewable green reactive diluent for bisphenol a epoxy resin system
In this work, a synthesized reactive diluent is investigated the effect on processability of conventional petroleum-based bisphenol A epoxy resins. The addition of reactive diluent not only greatly improves the processing properties of epoxy prepolymers, but also participates in the curing reaction.
Chemical Resistance for Ambient Cure Epoxy Formulations
The format includes summary sections on curing agent and resin selection, and the appendices include detailed data for the curing agent and resin combinations evaluated.
The molecular weight and curing dynamics of bisphenol a expansion chain
In this study, bisphenol A is used to expand the chain modification of low molecular weight epoxy resin, the infrared spectrum, molecular weight and distribution of epoxy resin after chain modification are explored.
Study on the Curing Kinetics and Properties of Bismaleimide Modified
Abstract This study introduced N, N '-4,4'-diphenylmethane bismaleimide (BMI) into the epoxy-anhydride resin EP-A (bisphenol A epoxy resin type, methyl nadic anhydride (MNA)) to prepare BMI modified epoxy resin (EP-B). The curing kinetics of EP-A and EP-B were comparatively studied by differential scanning calorimetry (DSC). Results showed that compared with EP-A, the introduction of BMI ...
In modern industry and construction, advancements in materials science have brought immense convenience and innovation to humanity. Among these, epoxy resins, as a class of high-performance thermosetting polymers, are widely used in electronics, aerospace, automotive, construction, and other industries due to their excellent mechanical properties, chemical resistance, and electrical insulation characteristics. The curing process of epoxy resins is particularly critical, as it directly determines the performance and lifespan of the final product.
The curing of epoxy resins is a complex chemical reaction involving multiple substances and conditions. In this process, curing agents play a vital role. Bisphenol A (BPA) is a commonly used curing agent for epoxy resins. It promotes curing by reacting with the epoxy groups in the resin. This reaction typically requires specific temperatures and generates exothermic heat.
As an organic compound, BPA possesses unique properties. Its molecular structure, featuring two benzene rings and a hydroxyl group, confers good thermal and chemical stability. BPA can react with various epoxy groups, including glycidyl ethers and glycidyl esters, effectively curing the resin. Additionally, BPA exhibits excellent solubility and compatibility, allowing it to be mixed with fillers, pigments, and other materials to optimize physical and chemical properties.
In practice, the use of BPA as a curing agent has evolved over decades. Early epoxy curing relied on thermal methods, which required high temperatures and long curing times. Technological progress revealed that adding BPA significantly accelerates curing, improves quality, reduces exothermic heat, minimizes defects, and enhances overall performance.
Beyond thermal curing, BPA can also enable chemical curing. For example, incorporating compounds with double bonds into epoxy resins allows reductive addition reactions with epoxy groups, boosting efficiency and expanding application scope.
despite its advantages, BPA’s use raises concerns. Its toxicity poses health risks with prolonged exposure, necessitating strict safety protocols. Additionally, its high cost increases production expenses, and environmental impacts—though BPA is biodegradable—may arise from large-scale usage.
Looking ahead, epoxy resin and curing technologies hold significant potential. Researchers are exploring more efficient, eco-friendly curing agents and methods, such as novel catalysts, bio-based alternatives, and low-carbon processes to reduce environmental burdens.
With decades of research and application, BPA remains indispensable in materials science. As technology advances and environmental awareness grows, epoxy resin curing is poised to become faster, safer, and greener, driving human progress.
