1、Preparation and characterization of a novel microcapsule
In this study, a novel microcapsule-type latent curing agent has been obtained by encapsulating butyl glycidyl ether modified 2-ethyl-4-methyl imidazole (BGE-M-2E4MZ) with polyetherimide (PEI) as the shell material through a simple emulsion/solvent evaporation method.
2、Latent curing agent DDM‐PMMA microcapsule for epoxy resin
A microcapsule-type latent curing agent is prepared by solvent evaporation method with diaminodiphenylmethane (DDM) as the core material and PMMA as the wall material.
3、Nanoclay‐modified microcapsules as a latent curing agent in epoxy
In this paper, the influence of the addition of nanoscale multi-layered MMT on the barrier property of SE resin used as a microcapsule shell for development of a latent curing agent for epoxy resins was studied.
Preparation of Latent Curing Agent for Epoxy Resin by Encapsulation
The microcapsule-type curing agents DDM-PMMA and IZ-PU were prepared by solvent evaporation method and interfacial polymerization method, respectively. The surface morphology of the two microcapsules was characterized by SEM.
Microsoft Word
In our previous study [6, 7], a microcapsule-type latent curing agent was prepared by solvent evaporation method with diaminodiphenylmethane (DDM) as the core material and PMMA as the wall...
Preparation of fully epoxy resin microcapsules and their application in
When cracks occur and propagate in composite materials, the capsules rupture and discharge the internal epoxy resin, which subsequently undergoes polymerization and curing to repair the cracks under the influence of a latent curing agent.
Latent curing agent DDM‐PMMA microcapsule for epoxy resin
The one‐component adhesive consisting of DDM‐PMMA microcapsule and epoxy resin can be cured within 30 min at 130 °C, and the room temperature latent period is more than 30 days.
Journal of Applied Polymer Science
The microcapsule parameters, morphology, structure, curing behavior, and the mechanic properties of cured epoxy resin with this microcapsule latent curing agent were characterized through comparing with 2-PhIm.
Imidazole
In this work, a novel microcapsule-type latent curing agent was obtained by encapsulating 1-benzyl-2-methylimidazole (1B2MZ) with double-shell material. PDA was deposited on the surface of the primary microcapsules PMCs to improve the shelf life of the one-component microcapsule–epoxy system.
Synthesis of double
In this work, a microcapsule-type latent curing agent with an extended storage period was successfully prepared by introducing a metal-organic framework (MOF) as its second-layer shell.
In the modern industrial manufacturing sector, advancements in materials science have provided more efficient and environmentally friendly solutions for various applications. Among these, epoxy curing agents, as a critical class of chemical additives, directly influence the quality and performance of final products. With increasingly stringent environmental protection requirements, developing low-volatile, long-lasting, and stable epoxy curing agents has become an important research focus. Against this backdrop, microcapsule latent epoxy curing agents have emerged as a hot research topic due to their unique advantages.
Microcapsule Technology involves encapsulating active substances within microscopic vesicles, stabilizing them through physical or chemical methods to prevent rupture. By integrating microcapsule technology into epoxy curing agents, the active ingredients can be effectively protected, and their service life extended. Microcapsule latent epoxy curing agents encapsulate the curing agent within microcapsules, enabling controlled, slow release during use. This avoids the environmental pollution caused by rapid volatilization of traditional curing agents.
The working principle of microcapsule latent epoxy curing agents is based on the kinetic properties of chemical reactions. When the curing agent inside the microcapsules reacts with epoxy resin, the smaller curing agent molecules diffuse rapidly into the resin and participate in the curing reaction. The microcapsule shell protects the curing agent from premature consumption and volatilization. This design not only improves the efficiency of the curing agent but also extends its effective lifespan in the environment.
Key advantages of microcapsule latent epoxy curing agents include:
- Reduced VOC emissions, significantly improving workplace conditions and lowering occupational health risks.
- Enhanced water resistance and corrosion resistance, as the encapsulated curing agent reduces unintended reactions with moisture.
- Long-term stability, ensuring sustained effectiveness without frequent replenishment, which lowers maintenance costs in industrial production.
Practical applications demonstrate the superior performance of these agents. In electronic packaging, they are widely used for circuit board encapsulation due to their excellent moisture resistance and electrical insulation. In construction, they provide longer shelf life and stronger adhesion, improving material durability. In automotive manufacturing, they enhance coatings and adhesives, boosting vehicle durability and safety.
Despite their benefits, challenges remain in the development and application of microcapsule latent epoxy curing agents. For instance, the stability and uniformity of microcapsules are critical and require precise control during preparation. Additionally, optimizing the type and ratio of curing agents for specific applications is necessary to achieve optimal performance. Future research should focus on refining microcapsule design, preparation methods, and tailoring curing agent formulations to meet diverse needs.
As an innovative industrial material, microcapsule latent epoxy curing agents are reshaping traditional material processing approaches with their eco-friendly and high-performance characteristics. With ongoing technological advancements, these agents are expected to play a larger role in industrial applications. Through continued research and practice, microcapsule latent epoxy curing agents hold significant promise for sustainable development and environmental protection.
