1、Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual

Herein, we present a dual-locked thermal latent curing agent based on aminopyridines, protected by amidation and N -oxidation, designed to enhance both pot life and final curing efficiency.

2、Thermal curing of epoxy resins at lower temperature using 4

To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.

3、Latent curing epoxy systems with reduced curing temperature and

Especially, TCBPA and TBBPA, participated as the latent curing agents, were expected to enhance shelf life as well as reduce curing temperature of the single component epoxy adhesives due to the activation of chloride and/or bromine groups on phenol-based compounds.

4、潜伏型环氧树脂固化剂研究进展

Meanwhile, the current evaluation methods of latent performance of curing agent are summarized, including DSC and rheological behavior analysis. Finally, the advantages and disadvantages of the current latent curing agents are evaluated, and the trends of future work are highlighted.

5、Latent Curing Agents for Epoxy Resins: A Comprehensive Exploration from

Unlike traditional additive curing agents, latent curing agents can encapsulate the epoxy resin before curing, forming a stable gel state. This allows the curing process to proceed at room temperature or lower temperatures, significantly simplifying the curing工艺 and improving production efficiency.

Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual

Herein, we present a dual-locked thermal latent curing agent based on aminopyridines, protected by amidation and N-oxidation, designed to enhance both pot life and final curing efficiency.

A Modified Imidazole as a Novel Latent Curing Agent with Toughening

Latent curing agents often have very low reactivity with epoxy resins at room temperature but could rapidly solidify the epoxy resins when certain heat, light or pressure appears. In addition, they should not impair the performance of cured material.

Liquid phosphorus

Herein, two liquid phosphorus-containing bis-imidazole compounds, PPDM and DPCMI, were synthesized as latent curing agents for EP, demonstrating multiple effects in improving latency, thermal stability, mechanical properties, and fire safety.

Ancamine® 2337M

While the need for a long shelf life and fast curing at low temperatures may seem contradictory, Evonik has developed Ancamine® 2337M to meet these challenges without compromising the typical properties of epoxy systems.

Research progress of medium temperature latent curing agent

The application and modification progress of several kinds of medium temperature latent curing agents such as dicyandiamide,imidazole,acid anhydride and microcapsules in epoxy resin system were reviewed,and the future research directions of such curing systems were prospected.

In the field of modern materials science, epoxy resins are renowned for their excellent mechanical properties, chemical stability, and electrical insulation. to fully leverage these characteristics, epoxy resins must undergo proper curing treatment. The curing process involves a physical transformation of epoxy resins from a liquid to a solid state, which not only affects the final performance of the material but also impacts costs, production efficiency, and environmental friendliness. In this context, mid-temperature latent curing agents play a crucial role.

Mid-temperature latent curing agents are chemical substances used to cure epoxy resins, capable of promoting the curing reaction at relatively low temperatures. Compared to high-temperature curing, mid-temperature curing offers higher efficiency and lower environmental impact. In traditional high-temperature curing processes, epoxy resins require prolonged heating at elevated temperatures, leading to increased energy consumption and potential thermal stress issues in the cured material. In contrast, mid-temperature latent curing agents achieve comparable curing effects at lower temperatures, reducing energy consumption and minimizing environmental burdens.

The mechanism of mid-temperature latent curing agents primarily relies on their ability to provide sufficient energy to initiate or accelerate the curing reaction of epoxy resins. This energy typically originates from reactive groups within the curing agent, which chemically react with the epoxide groups in the epoxy resin to form stable cross-linked structures. During this process, mid-temperature latent curing agents not only accelerate the curing rate but also enhance the mechanical properties and chemical resistance of the material.

The selection and application of mid-temperature latent curing agents require consideration of multiple factors. First, the type of curing agent directly affects its performance. Different latent curing agents have varying chemical structures and activation energies, necessitating the choice of appropriate curing agents based on specific application scenarios. Second, compatibility between the curing agent and epoxy resin is critical. Incompatibility may lead to curing failures or undesirable physical properties. Additionally, the dosage of the curing agent must be precisely controlled, as excessive or insufficient amounts can compromise curing outcomes.

Practical applications of mid-temperature latent curing agents are widespread. For example, in the electronics packaging industry, epoxy resins are commonly used to manufacture circuit boards and chip encapsulation materials. In such applications, mid-temperature latent curing agents ensure rapid curing of epoxy resins at lower temperatures while maintaining good electrical and mechanical properties. In construction, epoxy resins are often employed for reinforcing and repairing concrete structures, where mid-temperature latent curing agents effectively improve durability and load-bearing capacity.

Beyond these fields, mid-temperature latent curing agents are extensively used in aerospace, automotive manufacturing, medical devices, and other high-tech sectors. In these industries, high-performance materials are essential for ensuring product safety and reliability. By utilizing mid-temperature latent curing agents, the performance of epoxy resins can be significantly enhanced to meet stringent requirements.

Despite the significant progress achieved in applying mid-temperature latent curing agents to epoxy resin curing, challenges remain. These include further improving curing agent efficiency to reduce energy consumption, optimizing compatibility between curing agents and epoxy resins to avoid poor physical properties, and expanding the variety and performance of curing agents to accommodate diverse application needs. In the future, with advancements in materials science and technology, mid-temperature latent curing agents are expected to play an even greater role in the field of epoxy resin curing.

As a critical component of the epoxy resin curing process, mid-temperature latent curing agents are instrumental in enhancing material performance, reducing costs, and protecting the environment. By deepening our understanding of their mechanisms, optimizing formulations, and refining application practices, we can better leverage this technology to advance materials science and meet growing industrial demands.