1、Epoxy/phenolic nanocomposite based adhesives: Non
The curing behavior of an epoxy/phenolic-based system containing graphene oxide (GO), and rubber powder as a toughening agent has been studied using differential scanning calorimetry (DSC) under non-isothermal conditions at a temperature from 0 to 200 °C.
2、Ammonium Salts as Curing Agents to Obtain Ionic Epoxy Resins With a
Ionic epoxy networks are prepared using ammonium salts as hardeners, leading to a two-stage curing process with a thermoplastic-like intermediate. This uncommon behavior enables extrusion and fabrica...
3、Effect of the Structure of Epoxy Monomers and Curing Agents: Toward
The effect of the structures of epoxy monomers and curing agents regarding the intrinsic thermal conductivity, dielectric properties, insulation performance, thermomechanical properties, thermal stability, and hydrophobicity of the prepared epoxy resins was systematically explored.
4、Curing Kinetics of Epoxy Adhesive by Non
Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates...
Influence of different composite curing agents on the rapid curing
In particular, effective formulations are designed for mixing fast and slow curing agents, studying their effects on the curing behavior, curing quality, and mechanical properties of epoxy resins and elucidating their influence mechanisms.
A phosphorus/silicon hybrid curing agent for epoxy resin
This study proposes an effective strategy for the development of high-performance epoxy resin curing agents, offering fresh perspectives for overcoming traditional performance trade-offs through molecular structure design.
The Non
The reaction kinetics equation was set up for one Epoxy through calculation of curing parameters by Kissinger or Ozawa method and Crane formula from the non-isothermal DSC curves.
Using thermokinetic methods to enhance properties of epoxy resins with
Using biomolecules instead of synthetic curing agents can significantly reduce composites' toxicity and petrol-based carbon content. This study considerably exceeds the thermo-mechanical...
Preparation and Properties of Epoxy Adhesives with Fast Curing at Room
Developing a highly efficient multifunctional epoxy adhesive is still an enormous challenge, which can rapidly cure at room temperature and has excellent low-temperature resistance performance and is crucial for the epoxy adhesive and electrical sealing fields during severe cold seasons.
Study on curing kinetics of epoxy
In this report, curing kinetics of epoxy/amine is examined in an effort to reveal solutions to reducing temperature caused by the exothermic reaction. A versamid amine (VDETA) and a butyl ether modified amine (BDETA) derived from diethylene triamine (DETA) are employed as curing agents for a liquid diglycidyl ether of bisphenol A (DGEBA).
In modern industrial production, epoxy curing agents, as a critical component of epoxy resin systems, directly impact the quality and performance of final products. Traditional epoxy curing agents release significant heat during use, which not only raises environmental temperatures but may also cause discomfort to operators or even lead to safety hazards. developing non-exothermic epoxy curing agents is essential for improving production efficiency, ensuring worker safety, and reducing energy consumption.
Characteristics and Deficiencies of Traditional Epoxy Curing Agents
Traditional epoxy curing agents often rely on organic acid anhydride compounds. When reacting with epoxy resins, these compounds release substantial exothermic heat, elevating ambient temperatures. This heat not only affects operator comfort but may also cause equipment overheating, malfunctions, or even fires. Additionally, temperature rises during the curing process can lead to condensation of water vapor in the air, increasing humidity. This humidity negatively impacts equipment operation and product quality.
Necessity for Developing Novel Non-Exothermic Epoxy Curing Agents
With growing environmental awareness and urgent demands for energy conservation and emission reduction, developing non-exothermic epoxy curing agents has become an inevitable trend. Such curing agents generate minimal or no heat during curing, effectively avoiding problems caused by excessive temperatures. Reducing heat production also lowers energy consumption, aligning with green production goals.
Research and Development of Non-Exothermic Epoxy Curing Agents
The development of non-exothermic epoxy curing agents begins with molecular structure design, selecting raw materials with low melting points and high decomposition temperatures. Optimized molecular designs minimize energy loss during reactions, enabling high-efficiency energy conversion. Additionally, strict control of reaction conditions—such as temperature, pressure, and mixing speed—ensures optimal performance. These measures significantly improve the thermal stability and energy efficiency of the curing agents.
Application Prospects of Non-Exothermic Epoxy Curing Agents
Non-exothermic epoxy curing agents hold vast potential in industrial applications. First, they enhance product quality by enabling precise temperature control during curing, avoiding performance fluctuations due to temperature variations. Second, reduced heat generation improves workplace environments, boosting operator efficiency and health. Finally, their low-energy characteristics lower production costs, strengthening corporate competitiveness.
Developing non-exothermic epoxy curing agents is a viable solution to existing challenges. Through scientific molecular design and advanced processing techniques, this goal can be achieved, revolutionizing industrial production. As technology advances and applications expand, non-exothermic epoxy curing agents will play a pivotal role in future industries, driving progress toward more efficient, eco-friendly, and safe manufacturing.
