1、Microstructure regulation and fabrication of epoxy

In this study, an epoxy resin conductive adhesive film was prepared, with the advantages of electrical and thermal conductivity, adhesive performance, and mechanical properties.

2、Highly Thermally Conductive Liquid Crystalline Epoxy Resin Vitrimers

In this work, highly thermally conductive liquid crystalline epoxy resin (LCER) vitrimers are prepared by introducing biphenyl mesogens and dual dynamic disulfide and ester bonds into the cured network (Figure 1).

3、Effect of the Structure of Epoxy Monomers and Curing Agents: Toward

Herein, a liquid crystalline epoxy (LCE) monomer with a biphenyl mesogenic unit was first synthesized through an efficient one-step reaction.

4、Microstructure regulation and fabrication of epoxy

This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content.

Nickel conductive adhesive based on bisphenol A epoxy resin modified by

A small amount of nitrile rubber modified epoxy resin and bisphenol A epoxy resin can be used in combination, which can improve the brittleness of epoxy resin without affecting its heat resistance, and has a good application prospect in the field of low stress conductive adhesive.

Enhanced Thermal Conductivity of Epoxy Adhesive Films by Filling

Enhanced Thermal Conductivity of Epoxy Adhesive Films by Filling Surface-Modified AlN Published in: 2023 24th International Conference on Electronic Packaging Technology (ICEPT)

Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives

Electrically conductive adhesives (ECAs) are polymer-based composite adhesives typically formed by a resin and metal particles, and are an alternative to solder available since the mid-20th century. ECAs offer lightweight and a low environmental impact compared to lead-based solder.

Thermally Conductive Naphthalene Epoxy Resin by Tailoring Flexible

Naphthalene-based liquid crystal epoxy monomers (LCEs) with low liquid crystal temperature ranges (67–78 °C) were synthesized by modifying the flexible chain length on both sides of naphthalene.

Enhancement of mechanical properties of epoxy resin matrix adhesives by

All of these results indicate the role of modified fillers in improving the adhesive strength of epoxy resin composite adhesives, supporting previous conclusions about the mechanism by which IPDI and ATBN improve adhesive film adhesion [33].

Study on Thermomechanical Properties and Morphology of an Epoxy Resin

An epoxy resin thermally conductive adhesive is a type of thermosetting polymer encapsulation material that exhibits comprehensive performance, and the thermomechanical properties of this adhesive vary significantly under different curing conditions.

Epoxy Resin Modified Conductive Adhesive Film

In the rapid development of modern electronic technology, the miniaturization and high-performance demands of electronic devices are increasingly growing. To adapt to this trend, the development of a new type of epoxy resin-modified conductive adhesive film has become an important research direction in the field of electronic packaging. This novel conductive adhesive film not only exhibits excellent electrical conductivity but also possesses good mechanical strength, temperature resistance, and chemical stability, providing more reliable and efficient protection for electronic devices.

As a traditional thermosetting resin matrix material, epoxy resin’s excellent physical and chemical properties have made it widely used in the field of electronic packaging. Epoxy resin inherently offers strong adhesive properties and mechanical performance, enabling stable interface formation with various substrates, thereby ensuring the overall performance of the conductive adhesive film. its relatively poor electrical conductivity limits its application in scenarios requiring high conductivity.

To address this issue, researchers have introduced conductive fillers and additives to enhance the electrical conductivity of epoxy resin. Among these, carbon nanotubes (CNTs) are ideal conductive fillers. Their unique two-dimensional structure effectively increases the conductive pathways of the material, thereby improving overall conductivity. Additionally, incorporating appropriate amounts of conductive polymers or metal oxides can further enhance the electrical performance of the epoxy resin. The preparation methods for these composites include blending, solution mixing, melt blending, and others, with the choice depending on specific application needs and cost considerations.

Optimizing the performance of epoxy resin-modified conductive adhesive films involves multiple aspects. First, modifying the epoxy resin to improve its conductivity and mechanical properties is crucial. This can be achieved by altering the structure of the epoxy resin, introducing specific functional groups, or using specialized cross-linking agents. Second, selecting appropriate conductive fillers and additives is vital. Different types of fillers and additives have varying physical and chemical properties, which influence the performance of the conductive adhesive film differently. rational selection and proportioning based on practical application requirements are essential.

Additionally, the preparation process of epoxy resin-modified conductive adhesive films involves several key technical challenges. For instance, achieving uniform dispersion and distribution of epoxy resin and conductive fillers is critical to producing high-quality conductive films. This can be realized by adjusting processing parameters such as temperature, time, and mixing speed. Controlling the curing process of the epoxy resin is another important step. Factors like temperature, time, and pressure during curing significantly affect the final product’s conductivity, mechanical properties, and heat resistance. Thus, optimizing curing conditions through experimentation is necessary to achieve optimal performance.

epoxy resin-modified conductive adhesive films, as emerging electronic packaging materials, hold broad application prospects and significant research value. With the continuous advancement and innovation in electronic technology, the demand for high-performance electronic packaging materials will grow even stronger. The research and application of epoxy resin-modified conductive adhesive films will play a crucial role in enhancing the miniaturization, performance, and reliability of electronic devices. In the future, we look forward to more research breakthroughs and technological advancements to drive electronic packaging materials to new heights.