1、Thermal Degradation Behavior and Mechanism of Organosilicon Modified
In this work, a heat-resistant epoxy resin (ES231) is prepared through the condensation reaction between epoxy resin and methylphenyl organosilicon intermediate.
2、Effect of organosilicon modified epoxy resin on slurry viscosity and
In this study, an efficient method for synthesized high performance polyurethane grouting materials by improving the compatibility between composite materials.
3、有机硅改性环氧树脂的热降解行为及机理,Macromolecular
In this work, a heat-resistant epoxy resin (ES231) is prepared through the condensation reaction between epoxy resin and methylphenyl organosilicon intermediate.
4、Thermal Degradation Behavior and Mechanism of Organosilicon Modified
In this work, a heat‐resistant epoxy resin (ES231) was prepared through the condensation reaction between epoxy resin and methylphenyl organosilicon intermediate.
5、Organosilicon
In this work, organosilicon-modified epoxy resin coatings with liquid-repellent, anti-graffiti, and self-cleaning properties were fabricated for anti-smudge application.
聚醚改性有机硅消泡剂的合成及性能研究
The results showed that our homemade polyether modified polysiloxane defoamer had great defoaming performance and could satisfy the industrial technical requirements.
Tried
Antifoaming effect: epoxy resin defoamer has good effect on the foam produced by epoxy resin, AB adhesive, floor paint and other systems, it has the advantages of low dosage, fast defoaming speed, long foam suppression time, no oil spot, etc.
High
In this work, a high-branched silicone epoxy resin (QSiE) was synthesized and applied to the curing system of bisphenol A epoxy resin (DGEBA) for modification investigations.
Phase morphology modulation of silicone
In this study, phase control of silicones in modified epoxy resins was achieved by modulating the curing process, and a series of silicone-modified epoxy resins with different phase sizes were prepared.
合肥工业大学Dong, Xiaoyu、丁运生等人合作在SCI上发表
本研究提出了一种新的方法来改善聚氨酯灌浆材料的性能，成功合成了低浆料粘度、高机械强度和低放热反应的聚氨酯灌浆材料。 这项研究的创新点在于通过有机硅改性环氧树脂，提高了聚氨酯分子链的柔韧性，从而改善了灌浆材料的性能。 这项研究的意义在于提高了聚氨酯灌浆材料的性能，使其可以更广泛地应用于建筑和维护民用工程。 本研究提出了一种新的策略来解决这些问题。 通过在环氧树脂的主链上附加烷氧基硅烷基团，可以减少分子链之间的纠缠，从而增加聚氨酯分子链的柔韧性。
Abstract: In industrial production, eliminating foam is a critical step to ensure product quality and efficiency. Particularly in applications such as coatings, adhesives, and electronic encapsulation materials, even minute bubbles can severely compromise performance or lead to product rejection. Thus, developing an efficient and eco-friendly defoaming method is essential. This article explores the application and advantages of organosilicon-modified epoxy resins as a novel defoaming agent.
1. Introduction to Organosilicon-Modified Epoxy Resins
Organosilicon-modified epoxy resins are materials enhanced by incorporating organosilicon compounds to improve the properties of epoxy resins. This modification not only boosts mechanical strength, heat resistance, and chemical resistance but also enhances resistance to bubble formation. With excellent defoaming capabilities, these modified resins effectively suppress bubble generation in coatings, adhesives, and other products.
2. Defoaming Mechanism
Defoaming relies primarily on differences in surface tension. Bubbles rupture spontaneously when the liquid’s surface tension exceeds that of the bubbles. Organosilicon-modified epoxy resins contain polar groups in their molecular structure, significantly reducing liquid surface tension and preventing bubble formation and growth. Additionally, their chemical and thermal stability ensure sustained defoaming performance under harsh conditions.
3. Practical Applications
1. Coatings Industry Organosilicon-modified epoxy resins are widely used in primers and topcoats. For example, adding 0.5% of the modified resin to polyurethane coatings reduces bubble content by two-thirds, improving smoothness and adhesion.
2. Adhesives Industry In epoxy adhesives, incorporating 2% of the modified resin prevents bubble formation, enhancing bonding strength and durability. Tests show near-zero bubble retention post-curing.
3. Electronic Encapsulation Materials For semiconductor encapsulation, adding 1% of the modified resin reduces bubble content to less than 20% of the original, safeguarding device performance.
4. Conclusion and Outlook
As a highly efficient and eco-friendly defoaming agent, organosilicon-modified epoxy resins have broad industrial applications due to their unique molecular structures and chemical properties. Future advancements may expand their use while emphasizing environmentally friendly defoaming methods to support sustainable development.
Note: The translation maintains technical accuracy, preserves data (e.g., percentages), and adapts terminology for clarity in scientific contexts.
