1、Thermal curing of epoxy resins at lower temperature using 4

In this study, we present N -methyl- N -pyridyl amide derivatives as thermal latent curing agents for use at lower temperatures, along with their mechanism of epoxy curing through the generation of the highly reactive 4- (methylamino)pyridine (4MAPy) (Figure 1).

2、Preparation and properties of stretchable low temperature resistant

Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced.

3、Ancamine® 2337M

Ancamine® 2337M is an amine-based curing agent tailored for low-temperature curing applications, like electronics that remain stable under ambient conditions, ensuring extended shelf life and ease of handling.

4、Development of low temperature cure hybrid benzoxazine

The combination of Dicy and urea in epoxy curing, the Dicy acts as a cross-linking agent with epoxy resin while urea serves as a catalyst, accelerating the curing reaction at 146 and 210 °C.

5、Low

Thus, the development of low-temperature curing agents has become a critical issue, as they can significantly improve the curing efficiency of epoxy composites while maintaining or even enhancing their performance.

Epoxy Curing Agents – Latent Curing Agents for One Component Systems

There is no combination of dicy and urea that can cure epoxies in that short of time frame at that low of a temperature. Latent curing agents are clearly the choice for one component heat activated epoxy systems.

Low viscosity and low temperature curing reactive POSS/epoxy hybrid

Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing.

Epoxy Curing Agents

Clear and pigmented coatings based upon Amicure® IC curing agents exhibit very rapid hardness development, excellent low temperature cure, very good color and UV stability and excellent surface appearance.

Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual

Herein, we present a dual-locked thermal latent curing agent based on aminopyridines, protected by amidation and N-oxidation, designed to enhance both pot life and final curing eficiency.

Latent curing epoxy systems with reduced curing temperature and

Especially, TCBPA and TBBPA, participated as the latent curing agents, were expected to enhance shelf life as well as reduce curing temperature of the single component epoxy adhesives due to the activation of chloride and/or bromine groups on phenol-based compounds.

Introduction to Low-Temperature Curing Epoxy Curing Agents

In modern industry and manufacturing, epoxy resins are widely used due to their exceptional physical and chemical properties. achieving rapid and efficient curing of these high-performance materials has long been a significant challenge for engineers. With advancements in technology, a new class of low-temperature curing epoxy curing agents has emerged, offering innovative solutions for epoxy resin curing with unique performance characteristics.

I. Concept and Principles of Low-Temperature Curing Epoxy Curing Agents

Low-temperature curing epoxy curing agents are substances capable of promoting the rapid curing of epoxy resins at lower temperatures. Their mechanism involves reducing the activation energy required for the curing reaction of epoxy resins, thereby accelerating the curing process. These curing agents typically consist of one or more organic or inorganic compounds that react chemically with active groups in the epoxy resin, forming a stable cross-linked network. This enhances the material’s mechanical strength and chemical resistance.

II. Characteristics of Low-Temperature Curing Epoxy Curing Agents

1. Rapid Curing: Compared to traditional high-temperature curing methods, low-temperature curing agents enable fast curing at reduced temperatures, significantly shortening production cycles.

2. Energy Efficiency and Environmental Friendliness: The lower energy requirements for curing result in reduced energy consumption and minimized environmental pollution.

3. Broad Applicability: Besides epoxy resins, these curing agents can compatibly integrate with other resin systems, offering extensive application potential.

4. Simplified Processing: Compared to high-temperature methods, low-temperature curing agents simplify production processes, ease operation, and lower costs.

III. Applications of Low-Temperature Curing Epoxy Curing Agents

1. Aerospace Industry: In aerospace materials, low-temperature curing agents improve component performance and lifespan. For example, in the manufacture of turbine blades for aircraft engines, these agents reduce thermal stress while enhancing structural strength and fatigue resistance.

2. Automotive Manufacturing: Low-temperature curing agents are used to produce high-performance automotive parts, such as braking systems and suspension components. These parts endure prolonged high-temperature operations, and the curing agents provide superior mechanical strength and temperature resistance.

3. Electronics and Electricals: In electronic devices, these agents enhance the reliability and durability of circuit boards. For instance, during the fabrication of mobile phone and computer motherboards, low-temperature curing agents minimize thermal stress-induced failures.

IV. Challenges and Prospects of Low-Temperature Curing Epoxy Curing Agents

Despite their advantages, low-temperature curing agents face challenges in practical use. First, their higher costs may limit large-scale adoption. Second, compatibility issues between different types of agents require further research. Additionally, improving their performance to meet stricter application requirements remains a focus for future studies.

Looking ahead, the research and application of low-temperature curing epoxy curing agents hold promising prospects. With advancements in novel materials and technologies, these agents are expected to see broader adoption across industries, significantly contributing to the enhanced performance of epoxy resin materials.

As an emerging material processing technology, low-temperature curing epoxy curing agents are becoming a standout innovation in the epoxy resin field due to their unique properties and vast potential. With ongoing technological progress and cost reductions, these agents are poised to play a pivotal role in future industrial production, driving societal advancement and development.