1、Latent curing epoxy systems with reduced curing temperature and

Especially, TCBPA and TBBPA, participated as the latent curing agents, were expected to enhance shelf life as well as reduce curing temperature of the single component epoxy adhesives due to the activation of chloride and/or bromine groups on phenol-based compounds.

2、Thermal curing of epoxy resins at lower temperature using 4

In this study, we present N -methyl- N -pyridyl amide derivatives as thermal latent curing agents for use at lower temperatures, along with their mechanism of epoxy curing through the generation of the highly reactive 4- (methylamino)pyridine (4MAPy) (Figure 1).

3、Low viscosity and low temperature curing reactive POSS/epoxy hybrid

Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing.

4、Low

Thus, the development of low-temperature curing agents has become a critical issue, as they can significantly improve the curing efficiency of epoxy composites while maintaining or even enhancing their performance.

Low

The development of low-temperature fast-drying epoxy curing agents has not only improved production efficiency and reduced energy consumption but also broadened the application scope of epoxy materials while preserving their performance.

Ancamine® 2337M

While the need for a long shelf life and fast curing at low temperatures may seem contradictory, Evonik has developed Ancamine® 2337M to meet these challenges without compromising the typical properties of epoxy systems.

Development of low temperature cure hybrid benzoxazine

The combination of Dicy and urea in epoxy curing, the Dicy acts as a cross-linking agent with epoxy resin while urea serves as a catalyst, accelerating the curing reaction at 146 and 210 °C.

Preparation and properties of stretchable low temperature resistant

Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced.

Low

Low-temperature cured epoxy resin (EP) is a suitable resin system for bonding thermal and temperature-sensitive devices, which can also reduce energy consumption and production costs.

High and Low Temperature Resistant Epoxy Curing Agents

In an aerospace project requiring materials stable from -60°C to +150°C, a customized high- and low-temperature resistant epoxy curing agent enabled the epoxy to maintain consistent performance.

In modern industry, epoxy materials are widely used in various applications due to their excellent physical properties and chemical stability. achieving efficient curing of these high-performance epoxy materials while minimizing side reactions and environmental impact during the curing process remains a critical research topic. This article explores a low-temperature curing epoxy curing agent with reduced bleeding phenomena and its potential for practical applications.

1. Importance of Epoxy Curing Agents

Epoxy materials form a three-dimensional network structure through their reaction with curing agents, thereby acquiring the desired mechanical strength and other properties. Selecting an appropriate curing agent is crucial for achieving high-performance epoxy materials. The curing agent not only determines the final properties of the material but also affects the efficiency, safety, and environmental impact of the curing process. developing new low-temperature curing, low-bleeding epoxy curing agents holds significant industrial value.

2. Advantages of Low-Temperature Curing Technology

Traditional high-temperature curing methods can rapidly solidify epoxy materials, but they are unsuitable for temperature-sensitive industries such as aerospace and automotive manufacturing. Low-temperature curing technology reduces heat generation during the curing process, lowers energy consumption, and minimizes thermal pollution. Additionally, it enhances the material’s lifespan and reliability.

3. Research and Application of Reduced Bleeding Phenomena

Reduced bleeding refers to the release of certain chemicals or impurities from the curing agent into the environment during the curing process. This phenomenon not only degrades material performance but also poses environmental and health risks. Thus, developing low-bleeding epoxy curing agents is essential for environmentally sustainable and eco-friendly practices.

4. Exploration of Novel Low-Temperature, Low-Bleeding Epoxy Curing Agents

In recent years, researchers have made significant progress in developing new low-temperature epoxy curing agents. By refining formulations, introducing novel compounds, or adopting nanotechnology, they have successfully created a series of curing agents with excellent low-temperature curing performance and minimal bleeding characteristics.

For example, a novel epoxy curing agent enables rapid curing at lower temperatures while reducing side reactions and environmental impact. This curing agent employs a specialized catalytic system that efficiently promotes epoxy group reactions while suppressing harmful side reactions. Additionally, it exhibits optimal flowability and viscosity control, enhancing its practical applicability and adaptability.

5. Case Studies of Practical Applications

To validate the performance of the new low-temperature, low-bleeding epoxy curing agent, researchers conducted extensive practical tests. In the aerospace sector, this curing agent was used to manufacture high-strength, heat-resistant composite components. Results showed that components produced using this curing agent exhibited superior mechanical properties and thermal resistance, maintaining low bleeding rates over extended operational periods.

In the automotive industry, the curing agent was employed to produce lightweight, high-strength automotive parts. Long-term testing of various components revealed longer lifespans and lower maintenance costs when using this curing agent.

6. Future Prospects

With ongoing technological advancements, novel low-temperature, low-bleeding epoxy curing agents are expected to play an increasingly vital role in industrial applications. By further optimizing formulations and processing conditions, we can anticipate broader adoption of these curing agents across diverse fields, contributing to green manufacturing and sustainable development.

the research and development of low-temperature, low-bleeding epoxy curing agents represent a challenging yet promising field. Through continuous innovation and practical exploration, we can achieve more environmentally friendly, efficient, and cost-effective methods for preparing and applying epoxy materials.