1、Curing kinetics and thixotropic properties of epoxy resin composites

Herein, the three different kinds of inorganic fillers are utilized to investigate their influence on the thixotropic properties and curing kinetics of epoxy-amine system.

2、A review of the curing rate and mechanical properties of epoxy resin on

In epoxy resin composite, the curing rate of epoxy resin determines the production efficiency, cost, and applications. The majority of the composite preparation cycle is dedicated to the curing reaction of the epoxy resin matrix.

3、Effect of the Structure of Epoxy Monomers and Curing Agents: Toward

Herein, a liquid crystalline epoxy (LCE) monomer with a biphenyl mesogenic unit was first synthesized through an efficient one-step reaction.

4、The epoxy resin system: function and role of curing agents

Epoxy resins are frequently used in electrical devices, castings, packaging, adhesive, corrosion resistance, and dip coating. In the presence of curing agents, epoxy resins become rigid...

Curing

In this work, the effects on the curing-dependent modulus and the internal stress development of the epoxy/crosslinker chemistry, curing temperature, relative humidity, filler conditions, and initial solvent concentration, are studied.

Influence of fillers on epoxy resins properties: a review

While for the one-stage epoxy the heat is used as the curing agent, the two-stage epoxies comprise the resin, a curing agent and, in some cases, the presence of additives such as plasticizers, fillers or accelerators.

Curing Agent: Types & Process of Curing Agents for Epoxy Resin

Explore the main types of curing agents & various crosslinking methods which help to improve the polymerization process to select the right curing agent for coating formulation.

Mechanical and chemical properties of matrix composite: Curing agent

Epoxy resins are widely used as the matrix in fiber-reinforced polymer (FRP) composite because of their excellent properties. Epoxy properties were influenced by the mixing ratio and production process.

The epoxy resin system: function and role of curing agents

Curing agents are critical components of aqueous epoxy resin systems. Unfortunately, its uses and applications are restricted because of its low emulsifying yields. Epoxy resins are frequently used in electrical devices, castings, packaging, adhesive, corrosion resistance, and dip coating.

Natural Fillers as Potential Modifying Agents for Epoxy

Essentially, epoxy resins are low molecular weight liquids with two or more epoxide functional groups. These epoxide groups in epoxy resins can easily react with a wide range of curing agents/hardeners such as acids, anhydrides, alcohols, and amines.

In modern industrial and construction fields, epoxy resins are widely utilized due to their exceptional physical and chemical properties. to ensure these high-performance materials fully realize their potential, precise formulations and strict process control are essential. Among these, the selection and application of curing agent fillers are a critical step. This article explores the role, types, selection, and application techniques of epoxy resin curing agent fillers in depth.

1. The Importance of Epoxy Resin Curing Agent Fillers

1. Enhancing Adhesion: The cross-linked network formed by the reaction between curing agents and resins significantly improves cohesive strength and mechanical properties. This enhancement enables epoxy resins to be used in structural components, composites, and other applications requiring high load-bearing capacity.
2. Improving Electrical Performance: Metal ions or organic compounds in curing agent fillers act as mediators for electron transport, optimizing the performance of electronic devices such as semiconductors and optoelectronics.
3. Adjusting Physical and Chemical Properties: By varying the type and dosage of curing agents, properties like hardness, flexibility, and temperature resistance can be finely tuned to meet diverse application demands.

2. Types of Curing Agent Fillers

1. Anhydride Curing Agents: These react with epoxy resins to form thermosetting phenolic resins, offering excellent heat resistance and electrical insulation. They are suitable for manufacturing high-frequency circuit boards and structural components in high-temperature environments.
2. Amine Curing Agents: 包括脂肪族和芳香族胺类（Including aliphatic and aromatic amines）, they provide strong adhesion and mechanical properties, commonly used in electronic encapsulation and coatings.
3. Imidazole Curing Agents: With low volatility, these are ideal for applications requiring minimal gas release, such as aerospace and automotive industries.
4. Anhydride-Amidamide Hybrid Curing Agents: Combining the advantages of anhydrides and amides, they retain high heat resistance while offering improved processability, widely used in high-performance composites.

3. Selection and Application Techniques

1. Compatibility: The choice of curing agent fillers depends on resin type, intended use, and environmental conditions. For example, anhydride curing agents are preferred for high-temperature applications.
2. Proportion Control: The ratio of curing agent to resin directly impacts curing speed and final performance. Higher curing agent content accelerates curing but may over-harden the material.
3. Environmental Factors: Volatile curing agents affect operator health and workplace safety. Low-volatility options and effective ventilation are recommended.
4. Cost-Benefit Analysis: While prioritizing performance, cost considerations are critical. Some high-performance materials may be too expensive for general use cases.

The selection and application of epoxy resin curing agent fillers involve multifaceted considerations, including materials science, process technology, and economic factors. Careful choice of curing agent fillers can significantly enhance epoxy resin performance to meet stringent requirements. In the future, advancements in new materials and technologies will further diversify research and applications in this field, driving innovation and progress across industries.