1、Research status of mechanical modification of epoxy resin

To achieve this, researchers have adopted various methods to enhance the mechanical and physical properties of epoxy resin. Epoxy resin modification is a common method and has been subject to numerous innovations in recent years.

2、Surface modification of epoxy resin by MnO

The purpose of this study was to enhance the adhesion strength between the epoxy resin (EP) substrate and the electroless copper plating layer by utilizing a MnO2 –H 2 SO 4 –H 2 O–Na 4 P 2 O 7 system for surface modification.

3、Advances in Toughening Modification Methods for Epoxy Resins: A

Through a detailed analysis of experimental studies, this paper highlights the effectiveness of various toughening strategies and suggests future research directions aimed at further optimizing epoxy resin toughening techniques for diverse industrial applications.

Study on Modification of Epoxy Resin Reinforcing Adhesive Commonly Used

Epoxy resin reinforcing adhesive has become the most commonly used reinforcing adhesive in the aerospace field because of its wide bonding range, high bonding s

Modifications of Epoxy Resins and their Influence on their Viscosity

The following elaboration includes the results of modification tests of an epoxy resin with the addition of two inorganic fillers: microsilica (in the amount of 0.5% of resin weight) and carbon nanotubes (in the amount of 0.1% of resin mass).

Research progress on toughening modification of epoxy resin

Epoxy resin is a polymer material known for its high strength and rigidity,good chemical stability,and ease of processing.However,its brittleness seriously limits its applications.To address the toughening of epoxy resin,domestic and foreign scholars have conducted extensive research.The article mainly introduced the research ...

Advances in Toughening Modification Methods for Epoxy

This work provides a comprehensive review of the recent advancements in the toughening modification methods for epoxy resins.

Modification of epoxy resins with functional silanes, polysiloxanes

Epoxy resins are very important and widely used thermosetting polymers that find many practical applications. Very often their properties can be effectively modified by an addition of reactive silanes, polysiloxanes, silsesquioxanes, silica, montmorillonite, and other fillers.

Advances in Toughening Modification Methods for Epoxy Resins: A

Through a detailed analysis of experimental studies, this paper highlights the effectiveness of various toughening strategies and suggests future research directions aimed at further optimizing epoxy resin toughening techniques for diverse industrial applications.

Practical Technology of Toughening Epoxy Resin (II): Modification

During the epoxy curing process, strong intermolecular forces are generated between SEP and epoxy resin, which further enhances the heat resistance of modified epoxy resins. Better insulation of epoxy resin are achieved by adding engineering plastics with fine insulation equipment.

Modification of Epoxy Resin Boards: A Comprehensive Exploration from Basics to Applications

Epoxy resin boards, as high-performance thermosetting materials, are widely used in electronics, electrical engineering, automotive, aerospace, and construction due to their excellent mechanical properties, electrical insulation, and chemical stability. with the rising demands for material performance in modern industries, unmodified epoxy resin boards struggle to meet specific application requirements. Thus, modification has become an inevitable trend. This paper explores the principles, methods, and performance enhancements achieved through epoxy resin board modification.

I. Principles of Epoxy Resin Board Modification

1. Toughness Modification To improve toughness, elastomers or rubber fillers are added to form microcracks during curing, enhancing fracture resistance. Additionally, nanoparticles, carbon fibers, and other high-strength materials can boost both strength and toughness.

2. Heat Resistance Modification High-temperature curing techniques (e.g., autoclave curing, vacuum infusion) and the use of heat-resistant fillers or resins can elevate thermal stability.

3. Flame Retardancy Modification Flame retardants like aluminum hydroxide, magnesium hydroxide, or expandable flame retardants are incorporated. Formulations and oxygen index adjustments further improve fire resistance.

4. Moisture Resistance Modification Adding moisture-proof agents, humidity control, and formulation optimization (e.g., increased crosslinking density) enhance wet-environment durability.

5. UV Resistance Modification UV stabilizers such as benzotriazoles or hindered amine light stabilizers (HALS) are added. Improved formulations and weatherability also strengthen UV resistance.

II. Methods of Epoxy Resin Board Modification

1. Blending Modification Hybrid composites with tailored properties are created by blending epoxy resin with other resins or fillers, leveraging synergistic advantages.

2. Surface Treatment Modification Surface treatments (e.g., coating, electroplating, anodization) enhance wear resistance, corrosion resistance, and anti-fouling properties.

3. Grafting Modification Grafting monomers or polymers onto epoxy boards introduces specialized functions, such as conductivity or thermal conductivity.

4. Self-Assembled Nanomaterial Modification Integrating self-assembled nanomaterials (e.g., carbon nanotubes, graphene) improves mechanical and electrical properties.

III. Performance Enhancements Post-Modification

1. Mechanical Property Improvement Modifications significantly increase tensile, compressive, and flexural strengths, along with hardness and wear resistance.

2. Electrical Property Enhancement Conductive fillers or networks raise electrical conductivity and resistivity, critical for electronics like circuit boards and motor systems.

3. Optical Property Advancement Adding clarifiers or refractive index adjusters boosts light transmittance and reflectance, benefiting optoelectronics and optical instruments.

4. Thermal Property Optimization Thermal conductivity and stability are improved via导热 fillers and optimized curing processes, essential for heat sinks and exchangers.

5. Environmental Adaptability Enhanced moisture and UV resistance (via additives like anti-UV agents) enables outdoor applications, such as marine coatings and equipment.

Modifying epoxy resin boards is a complex yet vital endeavor, requiring fundamental research and practical design. Through ongoing technological innovation and process optimization, future advancements will likely yield higher-performance, multifunctional epoxy resin boards, driving progress across industries.