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Synthesis of Solvent-Free Epoxy Curing Agents

Resin expert  2025-10-25 10:01:15   17  6 Like

Synthesis of Solvent-Free Epoxy Curing Agents

1、Solvent

Here, core-shell structured curing agents were prepared via a dry particle coating (DPC) process that improved the storage stability of one-component epoxy adhesives. The DPC process is a simple, economic, and solvent-free method to fabricate core-shell structured materials using mechanical forces.

2、Solvent

In this research, fully biobased epoxy coatings were prepared from cardanol-derived resins with furfurylamine (FA) or 1,8-diamino- p -menthane (DAPM) as the curing agent without the use of any solvent.

3、Solvent‐free synthesis of phosphate‐containing imidazole fluid for

Herein, we synthesized a phosphate‐containing imidazole fluid (TA) as the thermal latent curing agent of EP. Based on simple structural design, TA endows EP with excellent curing...

Solvent‐free synthesis of phosphate‐containing imidazole fluid for

4、Synthesis and properties of a nonionic water

Ni et al. 21 synthesized a water-based epoxy resin curing agent with both emulsifying and curing functions by using propylene glycol methyl ether as a solvent and ethylenetetramine, epoxy resin, and polyethylene glycol as raw materials.

5、Facile synthesis of bio

In this work, a bio-based latent curing agent--phytate salt PAIM--was prepared by a simple salt-forming reaction between imidazole and naturally occurring phytic acid, and was mixed with commercial bisphenol A epoxy to obtain one-component epoxy system.

Solvent

In this research, fully biobased epoxy coatings were prepared from cardanol-derived resins with furfurylamine (FA) or 1,8-diamino-p-menthane (DAPM) as the curing agent without the use of any solvent.

Green and Facile Synthesis of Bio

Hence, a biomass-derived, flame-retardant, latent curing agent (IMPA) was synthesized via the neutralization between imidazole and phytic acid in water at room temperature and was applied for single-component epoxy resin (EP).

Solvent

Here, core-shell structured curing agents were prepared via a dry particle coating (DPC) process that improved the storage stability of one-component epoxy adhesives. The DPC process is a simple, economic, and solvent-free method to fabricate core-shell structured materials using mechanical forces.

Synthesis of isoliquiritigenin

To address this limitation, a novel bio-based benzoxazine monomer (ISO-fa) was strategically synthesized through molecular design employing isoliquiritigenin, furfurylamine, and paraformaldehyde as raw materials.

Synthesis and application of a halogen

A novel multi-functional polymeric curing agent: synthesis, characterization, and its epoxy resin with simultaneous excellent flame retardance and transparency.

Solvent-Free Epoxy Curing Agent Synthesis

Introduction

In modern industry, epoxy resins are widely utilized due to their excellent physical and chemical properties. traditional epoxy curing processes often involve the use of organic solvents, which not only increase production costs but also pose environmental hazards. developing solvent-free epoxy curing agents has become an urgent goal. This paper introduces an innovative method for synthesizing solvent-free epoxy curing agents and discusses its application prospects.

Overview of Traditional Epoxy Curing Agents

Conventional epoxy curing agents typically contain organic solvents such as toluene, xylene, and others. These solvents are not only costly but also flammable, explosive, and harmful to both the environment and human health. Additionally, the use of solvent-based curing agents limits the application range of epoxy resins, particularly in environments requiring high temperature resistance or chemical resistance.

Design Concept of Solvent-Free Epoxy Curing Agents

To address the drawbacks of traditional epoxy curing agents, researchers have proposed the concept of solvent-free epoxy curing agents. These curing agents eliminate the use of organic solvents and instead rely on chemical reactions to cure epoxy resins. The advantages of this novel approach include:

  1. Environmental Friendliness: The absence of solvents reduces pollution and environmental impact.
  2. Safety: Minimizes the use of flammable and explosive substances, enhancing workplace safety.
  3. Superior Performance: Compared to traditional curing agents, solvent-free epoxy curing agents offer better mechanical properties, temperature resistance, and chemical resistance.
  4. Versatility: Suitable for various epoxy resin systems, including thermosetting and UV-curable resins.

Synthesis Methods for Solvent-Free Epoxy Curing Agents

Raw Material Selection

The synthesis of solvent-free epoxy curing agents begins with selecting appropriate raw materials. Common choices include multifunctional epoxy compounds and polyols. These materials can be obtained through different chemical reactions, such as condensation polymerization for epoxy compounds or ring-opening polymerization for polyols.

Synthesis Steps

The process involves the following steps:

  1. Raw Material Pretreatment: Drying raw materials to remove moisture and impurities.
  2. Chemical Reaction: A specific reaction between multifunctional epoxy compounds and polyols generates a prepolymer. Reactions may include addition, condensation, or ring-opening polymerization.
  3. Post-Treatment: Enhancing the stability and viscosity of the prepolymer to meet practical application requirements.

Technical Challenges

Key challenges in the synthesis process include improving reaction rates and selectivity, as well as controlling the molecular weight and distribution of the product. Addressing these issues requires in-depth research and optimization of reaction conditions.

Application Prospectives

As solvent-free epoxy curing agent technology matures, its potential applications expand across multiple fields:

  • Aerospace: Used in manufacturing high-performance composite structural components.
  • Automotive Industry: Employed in producing lightweight, high-strength automotive parts.
  • Electronic Packaging: Applied to encapsulation and bonding of electronic devices.
  • Construction: Utilized in adhesives and sealants for building materials.

Solvent-free epoxy curing agents represent an eco-friendly, safe, and high-performance material innovation. Through ongoing research and development, they are poised to become mainstream in the epoxy curing field, driving broader applications and market demand. With technological advancements, solvent-free epoxy curing agents will continue to advance sustainability and efficiency in industrial applications.

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