1、Epoxy Curing Agents
Clear and pigmented coatings based upon Amicure® IC curing agents exhibit very rapid hardness development, excellent low temperature cure, very good color and UV stability and excellent surface appearance.
2、Technical Information Epoxy resin curing accelerator
San-apro's epoxy resin curing accelerators are used in the curing process of epoxy resins and curing agents. The following is an introduction to the types of curing accelerators suitable for curing agents and their characteristics.
3、ノバキュア｜旭化成株式会社
NOVACURE is liquid latent hardener and curing accelerator for epoxy resins, developed based on microcapsulation technology.
Development of a Novel Curing Accelerator
Rapid curing of epoxy foams at room temperature is critical to reducing energy consumption and processing time at the manufacturing sites. In this work, a novel ultra-accelerator was developed by mixing calcium carbonate with nitric acid, which acted as a blowing agent and remarkably stimulated foam hardening.
Accelerators for Latent Epoxy Curing Agents
By incorporating urea accelerators, the curing temperature can be lowered to 120 to 150˚C and can cure in less than 30 minutes, saving the formulator time and money in curing final parts, which is particularly important for automotive OEMs using one component epoxy adhesive.
Curing reactions of epoxy powder coatings in perspectives of chemical
This review discusses the types, reaction principles, characteristics of curing agents and accelerators that participate in the curing reaction with different epoxy resins.
Honrepoxy resin, curing agent, accelerator
- To be used together with liquid epoxy resin, suitable for epoxy embedding material, casting material, coating material, floor material, and adhesive. Textile treating agent, silk shrinkproof and resistance agent, Perchloride and PVC heat - stabilization agent.
HARDENER FOR ULTRA
ű A new high-solid curing agent for multi-component spray applications provides ultra-fast curing. ű It also provides excellent hardness development at low temperature and resistance to carbamation, corrosion and chemicals.
Thermally Controlled Acceleration of Epoxy Resin Curing through Polymer
Microscopy imaging showed the dissolution of the polymeric accelerators in epoxy resin above a critical temperature enabling a high reactivity. The best performing accelerator was then applied in an epoxy adhesive film formulation.
DMP
Epoxy resin curing accelerator DMP-30 (K-54), 2,4,6 tri (dimethylaminomethyl) phenol, is a tertiary amine type curing agent. The epoxy curing agent at room temperature for perishable as anhydrides, polyester amines, aliphatic amine curing agent, efficient accelerator.
Epoxy curing agents are critical chemical additives that significantly enhance the curing speed and final performance of epoxy resins. Among numerous epoxy curing agents, Accelerator K55 stands out for its excellent properties, becoming a favorite in industrial applications. This article explores the characteristics, mechanism of action, and practical applications of Accelerator K55 in modern industries.
Characteristics of Accelerator K55
Accelerator K55 is an organic compound with unique functional groups in its molecular structure. These groups react under specific conditions with epoxy resins, accelerating the curing process. Key features of K55 include:
- High Reactivity: K55 exhibits exceptionally high chemical reactivity, enabling rapid curing of epoxy resins within short timeframes.
- Excellent Compatibility: K55 is compatible with various epoxy resins, preventing issues like delamination or precipitation.
- Environmental Safety: K55 releases no harmful substances during use, posing no risks to environmental or operator health.
- Cost-Effective: Compared to other accelerators, K55 offers faster curing speeds and lower costs, delivering significant economic benefits.
Mechanism of Action of Accelerator K55
The efficacy of K55 stems from its chemical structure. During curing, K55 interacts with hydroxyl groups (-OH) in epoxy resins, forming cross-linked polymer networks that expedite curing. Additionally, it catalyzes reactions between epoxy resins and curing agents, further accelerating the process.
Applications in Modern Industries
Accelerator K55 is widely used across diverse industrial fields. Key examples include:
- Construction: In concrete reinforcement and repair materials, K55 reduces construction time and improves efficiency by speeding up curing.
- Automotive Manufacturing: As a curing agent for high-performance composites, K55 ensures rapid strength development and durability in automotive parts.
- Aerospace: K55 is favored for its ability to cure structural components quickly, meeting the demands of high-speed aviation.
- Electronic Encapsulation: Used in chip bonding and packaging, K55 provides fast curing to ensure stability and reliability of electronic components.
Accelerator K55 is a highly efficient epoxy curing agent with unmatched performance in modern industries. From construction to automotive manufacturing, aerospace, and electronics, K55 has proven indispensable. As technology advances, K55 is poised to drive further innovation and contribution across sectors.
