1、多巴胺修饰PEEK及其表面化学镀铜

Results show that silver nanoparticles can effectively catalyze the polydopamine-assisted electroless copper plating on the PEEK surface with a more stable process. The copper layers are deposited on the PEEK surface with a good adhesion strength (5B scale).

2、Functionalized silver composite catalysts for electroless copper

The silver nanocomposite catalyst is constructed from a Polyethyleneimine (PEI) backbone, cross-linked with either glutaraldehyde (GA) or dopamine (DA) to form two functional copolymers designed for electroless copper plating.

3、Study on Adhesion Properties and Process Parameters of Electroless

In this study, Ni-P alloy was electroless deposited on PEEK, 30% carbon-fiber-reinforced PEEK (CF30/PEEK), and 30% glass-fiber-reinforced PEEK (GF30/PEEK) with varying surface roughness. The influence of surface roughness and modified fibers on the coating adhesion was studied.

4、Design of metalized polyether

Herein, based on semi-additive manufacture, 3-glycidyloxypropyltrimethoxysilane is selected to bridge polyether-ether-ketone (PEEK) and copper at the nanoscale interface. Followed by electroless plating, a metal film is planted on the insulating substrate for selective electroplating of copper.

5、Electroless Copper Plating on PEEK Surface Modified by Dopamine

Fig. 4 EDS spectra of silver-activated and copper-plated PEEK (plating for 60 min) - "Electroless Copper Plating on PEEK Surface Modified by Dopamine"

Silver electroless plating on 3D printed resins via stereolithography

Electroless plating is a simple method to manufacture conductive coatings on electrically insulating substrates such as polymers. In this paper silver electroless plating has been performed on 3D printed polymeric samples manufactured by stereolithographic process.

Electroless Copper Plating on PEEK Surface Modified by

A facile and efficient approach was developed to prepare copper-plated PEEK sheet with the assist of dopamine. The PEEK surface was coarsened by the method of non-solvent induced phase separation (NIPS) to obtain a large number of microscopic interconnected holes.

Seedless and electroless plating of silver on silica particles by using

In this study, we applied a microrector to seedless and electroless plating of silver on bare silica particles, and investigated the effects of reaction temperatures and silver ion concentrations on the morphology and surface coverage of silver on the core particle surface.

Functionalized silver composite catalysts for electroless copper

The silver nanocomposite catalyst is constructed from a Polyethyleneimine (PEI) backbone, cross-linked with either glutaraldehyde (GA) or dopamine (DA) to form two functional copolymers designed for electroless copper plating.

Process of electroless plating experiment.

Polyetheretherketone (PEEK) and its fiber-reinforced materials are thermoplastic polymer materials with broad application prospects. Depositing Ni-P alloy on them can improve their poor...

With the rapid development of technology, the research and application of new materials have become the key force driving industrial progress. Among many materials, polyetheretherketone (PEEK) occupies an irreplaceable position in high-end manufacturing, aerospace, biomedical and other fields due to its excellent mechanical properties, high temperature resistance and chemical stability. some physical characteristics of PEEK itself, such as low conductivity, limit its application in the electronics field. To solve this problem, scientists have developed a series of modification technologies, among which electroless plating silver resin serves as an effective solution, bringing significant performance enhancements to PEEK.

Electroless plating silver resin is a composite material in which silver ions are fixed on a resin matrix through electrolytic deposition. It not onlyinherits the high heat resistance, high mechanical strength and good chemical stability of PEEK, but also possesses excellent electrical conductivity due to its surface covered with a uniform layer of silver. This modified resin shows great application potential in electronic devices, sensors, conductive coatings and other fields.

The electrical conductivity of PEEK modified electroless plating silver resin is one of its most remarkable features. Compared with traditional PEEK materials, a dense silver film is formed on the surface of electroless plating silver resin, which greatly improves the electrical conductivity of the material. In applications that require good conductivity such as electronic circuit boards and flexible circuit boards, this material can provide higher signal transmission efficiency and lower energy consumption. due to the excellent thermal conductivity of silver, PEEK modified electroless plating silver resin has become an ideal choice for heat dissipation materials, which is important for improving the stability and service life of electronic equipment.

Besides its excellent electrical conductivity, PEEK modified electroless plating silver resin also possesses a series of other outstanding physical and chemical properties. It has high mechanical strength and good fatigue resistance, enabling it to maintain good performance in extreme environments. Meanwhile, due to the addition of the silver layer, this material also has good corrosion resistance and oxidation resistance, allowing it to maintain stable performance in harsh environments. Additionally, the processing performance of electroless plating silver resin has been significantly improved, making it possible to produce high-quality and high-performance products by injection molding, extrusion molding or other processing methods.

In practical applications, PEEK modified electroless plating silver resin has demonstrated its unique advantages. For example, in flexible electronic products, traditional conductive materials often fail to meet the requirements of thinness and multifunctionality. flexible circuit boards made of PEEK modified electroless plating silver resin not only have excellent electrical conductivity but also exhibit good flexibility and bendability, meeting the design needs of various shapes. In the medical device field, due to its excellent biocompatibility and low toxicity, PEEK modified electroless plating silver resin has a broad application prospect in human implants and surgical instruments.

Although PEEK modified electroless plating silver resin has shown great potential in many fields, it still faces some challenges in large-scale production and wide application. Firstly, the formation process of the electroless silver layer is relatively complex, requiring precise control of process parameters to ensure the uniformity and adhesion of the silver layer. Secondly, although the electrical conductivity of electroless plating silver resin is excellent, its cost is relatively high, which may limit its application in some low-cost sensitive areas. Finally, long-term exposure to high temperatures or damp environments may cause degradation of the electroless silver layer, affecting the long-term stability of its performance.

Looking ahead, with the development of materials science and electronic engineering, we have reason to believe that PEEK modified electroless plating silver resin will play a more important role in electronics, medical care, aviation and other fields. By furtheroptimizing the production process, reducing costs and improving product stability and reliability, this modified resin is expected to become the preferred material for more high-performance applications. With continuous technological advancement and innovation, the future of PEEK modified electroless plating silver resin is full of infinite possibilities.