1、Structural and thermal behavior of a novel phenolic resin and its

The formation of more p-p’ type methylene structures of phenolic resin profoundly contributed to the outstanding initial decomposition temperatures and char yield. TBPR matrix transformed into a stronger protective char layer, forming an effective thermal protection barrier.

2、New Insights into Phenolic Resin Decomposition under Oxidative

Herein, this work systematically explores the pyrolysis mechanism of PF resin under various high-temperature oxidation environments by using pyrolysis experiments and molecular dynamics simulations.

3、Synthesis and Thermal Degradation Study of Polyhedral Oligomeric

After introducing POSS into the resole, a comprehensive study is conducted to reveal the effects of POSS on the thermal degradation of phenolic resin. First, thermal degradation behaviors of neat phenolic resin and modified phenolic resin are carried out by thermogravimetric analysis (TGA).

Thermal Decomposition Kinetic Model of Phenolic Resin

A peak separation was performed to separate the thermal decomposition of phenolic resin into three stages according to the characteristic of the experimental differential mass loss curve....

Boron

A multiple-scale methodology integrating experimental characterization with classical molecular dynamics (MD) and reactive force field molecular dynamics (ReaxFF MD) was employed to systematically investigate the T g, thermal conductivity, and pyrolysis mechanisms of modified phenolic resins.

Homogenization

Under high temperatures, SiFPRCs undergo complex physicochemical changes and ablation-phase transition processes, including the thermal decomposition of phenolic resin, melting and sintering of Silica fiber.

(PDF) Thermal Degradation of Modified Phenol

In this work, the thermal stability of modified phenol formaldehyde was studied using thermogravimetric analysis (TG/DTA) at heating rate of 10oC/min to understand the step of the...

Thermal behavior of N

This paper explains N-Methylaniline modified phenolic resin effect on thermal properties of new eco-friendly brake friction composites.

Thermal Decomposition of Wood Treated with K2CO3 and Melamine Modified

The flame retardancy of the wood samples treated with K 2 CO 3, melamine modified phenolic resin (MMPR), and their mixture of K 2 CO 3 /MMPR was studied with the limiting oxygen index (LOI) method.

Reactive Molecular Dynamics Study of the Thermal Decomposition of

Atomistic models of the polyphenolic resins to be used in the RMD were constructed using an automatic method which calls routines from the software package Materials Studio. In order to validate the models, simulated densities and heat capacities were compared with experimental values.

In modern industrial production, modified phenolic resins are widely utilized in electronics, electrical insulation materials, composites, and various industrial products due to their unique thermal stability, excellent mechanical properties, and chemical inertness. with technological advancements and evolving market demands, the performance requirements for these resins have risen, particularly concerning their thermal decomposition characteristics. This paper provides an in-depth exploration of the decomposition mechanisms, influencing factors, and practical applications of modified phenolic resins during heating.

Modified Phenolic Resins: Composition and Properties Modified phenolic resins are high-performance polymers derived from phenolic resins through specialized treatments. By incorporating organic or inorganic fillers, plasticizers, and other additives, their heat resistance, moisture resistance, and mechanical strength are significantly enhanced. These resins maintain stability at high temperatures, but undergo complex thermal decomposition when the temperature exceeds a critical threshold.

Stages of Thermal Decomposition The thermal decomposition process of modified phenolic resins can be divided into three stages:

1. Initial Decomposition Stage (100°C–200°C): At this stage, the resin releases moisture and other volatile substances. The decomposition rate is relatively slow, producing primarily water vapor, low-molecular-weight volatile compounds, and minor oligomers.

2. Mid-Decomposition Stage (350°C–450°C): As temperatures rise, the resin enters a rapid decomposition phase. Intense reactions occur, releasing large amounts of gases such as formaldehyde and phenol. Simultaneously, macromolecular structures break down, generating more oligomers.

3. Late-Decomposition Stage (Above 450°C): At higher temperatures, the resin undergoes drastic thermal decomposition. Gases like carbon dioxide and nitrogen are released, accompanied by significant coke formation. This stage is critical for determining the quality of end products.

Key Factors Affecting Thermal Decomposition

1. Resin Composition: The type and amount of modifiers and fillers significantly impact thermal stability. For example, adding silicates improves heat resistance, while excessive fillers may accelerate decomposition.

2. Temperature: Temperature is a critical driver of decomposition. Higher temperatures promote reactions but increase energy consumption and byproduct formation. Optimal temperature control is essential for balancing performance and efficiency.

3. Pressure: High-pressure environments can accelerate decomposition by enhancing molecular interactions, though this effect varies depending on resin formulation.

4. Heating Time: Prolonged heating improves thermal stability and product quality but may increase byproduct accumulation. Careful time management is crucial.

Practical Application: Electronic Packaging Materials In electronic encapsulation, modified phenolic resins are prized for their electrical insulation properties and low thermal expansion. For instance, a leading electronics manufacturer adopted a specific modified phenolic resin as a substrate encapsulant. During production, the resin decomposed at controlled temperatures, releasing volatiles without warping or burning. This material significantly enhanced product reliability and safety, earning widespread market recognition.

The thermal decomposition of modified phenolic resins is a complex physicochemical process influenced by composition, temperature, pressure, and time. By understanding and optimizing these factors, the resins’ performance can be tailored to meet modern industrial demands. Future advancements in material science are expected to introduce even more specialized modified phenolic resins for advanced applications.