A phosphorus/silicon hybrid curing agent for epoxy resin
1、A phosphorus/silicon hybrid curing agent for epoxy resin
This study develop a phosphorus‑silicon hybrid curing agent (DA) with rational structural design that synergistically enhances the flame retardancy, thermal stability, and toughness of epoxy resins.
2、Phosphorus
The present work reports the synthesis of novel phosphorus- and silicon-based curing agent for epoxy resins which can be used as a reactive FR moiety. The final product was used along with the commercial polyamide in different proportions for curing the commercial epoxy.
3、A phosphorus/silicon hybrid curing agent for epoxy resin
To overcome this critical limitation, we engineered a phosphorus‑silicon synergistic curing agent (DA), where the incorporation of thermally stable SiO bonds and amide linkages effectively mitigates the thermal instability inherent in phosphorus-based components.
4、Heat
Heat-resistant flame-proof phosphorus- and silicon-containing hybrid curing agent for epoxy type electronic polymer material and preparation thereof
5、Preparation, thermal properties, and flame retardance of epoxy–silica
The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed.
A novel phosphorus−silicon containing epoxy resin with enhanced thermal
A novel phosphorus−silicon containing epoxy resin (EF−P/Si) was prepared by introducing a phosphoric triamide (PTA) and epoxy−functionalized polysiloxane (EFP) into the Bisphenol F epoxy resin/4,4′−diaminodiphenyl methane (DDM) system to improve its flame retardancy and mechanical properties.
A phosphorus/silicon hybrid curing agent for epoxy resin
A phosphorus/silicon hybrid curing agent for epoxy resin: Synergistically enhanced thermal resistance, flame retardancy, and toughness - 科研通
A phosphorus/silicon hybrid curing agent for epoxy resin
To overcome this critical limitation, we engineered a phosphorus‑silicon synergistic curing agent (DA), where the incorporation of thermally stable Si [sbnd]O bonds and amide linkages effectively mitigates the thermal instability inherent in phosphorus-based components.
A phosphorus/silicon hybrid curing agent for epoxy resin
Semantic Scholar extracted view of "A phosphorus/silicon hybrid curing agent for epoxy resin: Synergistically enhanced thermal resistance, flame retardancy, and toughness" by Min Yu et al.
<br hidden="">一种用于环氧树脂的磷/硅杂化固化剂：协同
To overcome this critical limitation, we engineered a phosphorus‑silicon synergistic curing agent (DA), where the incorporation of thermally stable SiO bonds and amide linkages effectively mitigates the thermal instability inherent in phosphorus-based components.