Thermal curing of epoxy resins at lower temperature using 4
1、Thermal curing of epoxy resins at lower temperature using 4
To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.
2、<br>使用 4
在本文中，我们介绍了用于环氧树脂的新型热潜伏固化剂的使用，与含有咪唑作为固化剂的环氧树脂相比，它们在较低的固化温度下是有效的——它们基于 4-（甲氨基）吡啶 （4MAPy），反应性被不同的酰胺保护基团抑制。
3、Thermal curing of epoxy resins at lower temperature using 4
Article on Thermal curing of epoxy resins at lower temperature using 4‐ (methylamino)pyridine derivatives as novel thermal latent curing agents, published in Journal of Polymer Science on 2024-07-04 by Daisuke Aoki+3.
4、Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual
Herein, we present a dual-locked thermal latent curing agent based on aminopyridines, protected by amidation and N -oxidation, designed to enhance both pot life and final curing efficiency.
5、Effects of curing temperature on the structure and properties of epoxy
Herein, two typical amine-type curing agents, 4,4′-diamino diphenylmethane (DDM) with precuring temperature at around 150 °C and diethylenetriamine (DETA) at 80 °C were utilized to regulate and control the phase structures of EP-poly (ε -caprolactone) (PCL) blends.
Thermal curing of epoxy resins at lower temperature using 4
To expand the application fields of epoxy resins, there has been a growing demand for thermal latent curing agents that combine a lower curing temperature with a long storage lifetime for a one-component epoxy formulation.
Low viscosity and low temperature curing reactive POSS/epoxy hybrid
This research utilized organic–inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.
Thermal curing of epoxy resins at lower temperature using 4
Herein, we present the use of novel thermal latent curing agents for epoxy resins that are effective at lower curing temperatures compared to epoxy resins containing imidazoles as curing agents—they are based on 4-(methylamino)
Development of low temperature cure hybrid benzoxazine
New type of diallyl bisphenol-A (ABA) based benzoxazines and benzoxazine resins tailored with epoxy groups for low-temperature curing, have been developed using various curatives for high performance applications.
Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual
We reveal a novel stepwise curing mechanism of epoxy resin using the present dual-locked 4MApy, unlike conventional thermal latent curing agents, as evidenced by 1H NMR, MALDI-TOF MS, and DSC analyses.